Thermoreflectance measurements of transient temperature upon integrated circuits : application to thermal conductivity identificationPHAN, T; DILHAIRE, S; QUINTARD, V et al.Microelectronics journal. 1998, Vol 29, Num 4-5, pp 181-190, issn 0959-8324Conference Paper

Early detection of ageing in solder joints through laser probe thermal analysis of the Peltier effectCLAEYS, W; QUINTARD, V; DILHAIRE, S et al.Quality and reliability engineering international. 1994, Vol 10, Num 4, pp 289-295, issn 0748-8017Conference Paper

Paramètres de répartition et bandes interdites d'un cristal photonique bidimensionnel discrétisé = Repartition parameters and bandgaps of a discretized bidimensional photonic crystalLE FLOC'H, L; QUINTARD, V; FAVENNEC, J.-F et al.Journal de physique. IV. 2002, Vol 96, pp Pr5.283-Pr5.284, issn 1155-4339Conference Paper

Optical packet synchronization device based on acousto-optic interaction : characterization and performanceQUINTARD, V; PERENNOU, A; NACIRI, Y et al.Journal of optics. A, Pure and applied optics (Print). 2001, Vol 3, Num 4, pp S62-S67, issn 1464-4258Conference Paper

Characterizations for an acousto-optic switch architecture with phased array transducersQUINTARD, V; PERENNOU, A; MEVEL, Y et al.SPIE proceedings series. 2002, pp 567-576, isbn 0-8194-4649-1, 10 p.Conference Paper

Optical ammeter for integrated circuit characterization and failure analysisCLAEYS, W; DILHAIRE, S; LEWIS, D et al.Quality and reliability engineering international. 1995, Vol 11, Num 4, pp 247-251, issn 0748-8017Conference Paper

Laser probe measurements of quality evolution of solder joints during thermal cycling ageing testsQUINTARD, V; PARMENTIER, B; PHAN, T et al.Quality and reliability engineering international. 1996, Vol 12, Num 6, pp 447-451, issn 0748-8017Article

Thermoreflectance optical test probe for the measurement of current-induced temperature changes in microelectronic componentsCLAEYS, W; DILHAIRE, S; QUINTARD, V et al.Quality and reliability engineering international. 1993, Vol 9, Num 4, pp 303-308, issn 0748-8017Conference Paper

Modelling and experimental study of heat deposition and transport in a semiconductor laser diodeLEWIS, D; DILHAIRE, S; PHAN, T et al.Microelectronics journal. 1998, Vol 29, Num 4-5, pp 171-179, issn 0959-8324Conference Paper

The method of dynamic separation and its application to quantitative thermal analysis of microelectronic devices by laser interferometry and reflectometryPHAN, T; DILHAIRE, S; QUINTARD, V et al.Measurement science & technology (Print). 1997, Vol 8, Num 3, pp 303-316, issn 0957-0233Article

Laser probing determination of the thermal conductivity of integrated circuit dielectric layersPHAN, T; DILHAIRE, S; BATSALE, J.-C et al.High Temperatures. High Pressures (Print). 1997, Vol 29, Num 1, pp 81-88, issn 0018-1544Conference Paper

Testing of the quality of solder joints through the analysis of their thermal behaviour with an interferometric laser probeCLAEYS, W; QUINTARD, V; DILHAIRE, S et al.Quality and reliability engineering international. 1994, Vol 10, Num 3, pp 237-242, issn 0748-8017Article